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DuPont Taiwan, TAIFLEX, Mektec, And ITRI Discussed FPC Thinning Technology In The Hopes Of Breaking Through The Manufacturing Dilemma
- Jan 06, 2018 -

     As mobile devices, such as smart phones, tablet PCs, and wearable devices, become more and more diverse, the global demand for flexible printed circuits (FPCs) has risen. FPCs can also be seen in the field of automotive electronics. FPCs can be said to be the product type that currently has the most growth potential among the world’s circuit boards. On August 24, the Taiwan Printed Circuit Association (TPCA) organized the Seminar on FPC Thinning & MSAP Technology, where Dupont Taiwan, TAIFLEX Scientific Co., Ltd. (TAIFLEX), Mektec Industrial Corp, Ltd. (Mektec), and Mechanical and Mechatronics Systems Research Laboratories, Industrial Technology Research Institute (MMSL, ITRI) were invited to discuss the new FPC trend.


     In the first lecture on “Polyimide Films for Fine Pattern FPC Application,” Director Chang, Chun-Lai from Dupont Taiwan introduced all kinds of advanced material solutions to FPC thinning; in the second lecture, which was on “FPC Thinning Materials,” Deputy Manager Hung, Chi-Cheng from TAIFLEX shared the line forming methods, analyzed the choices and requirements for thinning, and ultimately explained thinning materials.


     In the third lecture, an “Introduction to Some Sorts of SAP,” Vice President Su, Wen-Yen from Mektec pointed out that the demand for high-frequency materials is highly valued in 2017 and shared the applications of Fine Pitch, SAP, MSAP, and additive processes in PCBs; at the end, Vice President Su gave a complete analysis of performance test items for verification and quality assurance. In the last lecture, “Full Additive Processes for Ultra-Fine Conductive Lines,” Manager Wang, Yu-Ming from MMSL, ITRI explained that MMSL can reduce the width of the conductive line to 5 um and improve the yield of the ultra-fine conductive line by integrating key components, equipment, and materials of gravure offset printing, thus achieving a streamlined process, rapid manufacturing, high substrate applicability, low energy consumption, and an efficient use of materials.