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Fr-4 Copper Clad Laminate Sheet/Ccl
- Jan 05, 2018 -

Basic Info

Product Description

Model NO.: FR-4

Dielectric: FR-4

Color:Nature: Dimension:Customized

Type: Rigid Circuit Board

Material: Fiberglass Epoxy

UV Blocking/Aoi: UL, VDE, SGS, CQC, Reach, RoHS

1. Excellent appearance

2. Tg 140 degree celsius(DSC)

3. UV Blocking/AOI

4. Excellent machining property

HRFR-4 Laminate Unit specification Typical Value Test 

Method 

Metric <0.5mm ≥0.5mm 1.6mm  CCL IPC-TM-650 

1. Peel Strength,as received N/mm       1.80

(1OZ ) --- 

A. 17micron copper ≥0.79 ≥1.05 

B. 35micron copper ≥1.05 ≥1.40 

C. 70micron copper ≥1.40 ≥1.93 

D. 105,140,175micron copper and above ≥1.58 ≥2.10 

2.  Surface resistivity MΩ      

---

5.4×107

5.6×106 

A. Constant temp.&moisture C-96/35/90 ≥104 --- 

B. After moisture resistance  --- ≥104 

C. Under high temperature  ≥103 ≥103 

3. Volume resistivity MΩ.cm      

---

5.4×108

5.6×106 

A. Constant temp.&moisture C-96/35/90 ≥106 --- 

B. After moisture resistance  --- ≥104 

C. Under high temperature ≥103 ≥103 

4. Moisture absorption percent --- ≤0.80 0.15 

5. Dielectric breakdown KV --- 40 50 

6. Permittivity at 1MHZ -- <5.4 <5.4 4.6 

7. Tg(DSC) degree celsius --- ≥130 138 

8. Loss tangent at 1MHZ -- <0.035 <0.035 0.015 

9. Pressure Vessel Method 260 degree celsius/20S pass pass pass 

pass pass pass 

10. Thermal stress 288 degree celsius/20S       

Non etching pass pass pass 

Etch pass pass pass 

11. Flammability Rating 94V-0 94V-0 94V-0 

12. Dimensional stability ppm --- ±300 ±180