· Model NO.: FR4 CCL B Grade
· Solid Content: Fr4 CCL
· Formation Methods: Copper Clad Laminate
· Delivery: 7-10 Working Days
· MOQ: 5 tons
· Type: FR4Copper Clad Laminate Sheet
· Material: Fiberglass+PP+Copper
· Appliction: LED & Speaker
· Customizable: Rigid PCB
· Thermal Rating: H 180
· Classification: Hybrid Insulation Materials
· Color: Yellow
· Origin: China
Rigid PCB FR4 Copper Clad Laminate sheet
combines a woven glass fabric and an epoxy resin laminate (tg approximately 130°c) that contains bromine. The product provides consistent quality and good electrical properties under dry and humid conditions, as well as high flexural, impact, and bond strength at room temperatures. This product is suitable for a variety of structural, high humidity, and electrical insulation applications, which include terminal boards, lapping carriers.
Thickness of copper:18um, 25um,35um.
Copper: Single side (H/0) and double side (H/H)
1) The end face of foil covered board should be tidy without any delamination
and crackle .
2) B grade will have small bubble, wrinkle, pin hole, deep nick, pitting and glue spot on the copper foil covered surface. Any color changing or dirty can be easily. removed by density 1.02g/cm3 hydrochloric acid or proper organic solution .
3. Applications: Usually used in PCB of computers, home electric appliances and other lines.
FR4 CCL / Copper Clad Laminate Technical Date:
FR4 TECHNICAL DATA SHEET
Surface resistance after damp heat and recovery
Volume resistivity after damp heat and recovery
Permittivity after damp heat and recovery
Dissipation factor after damp heat and recovery
Peel strength after exposure to solvent vapour
Blistering after 10s heat shock
No blistering or delamination
Solderability (wetting test)
Flammability(vertical burning test)
FV0 or FV1
No measling or blistering or delamination
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