Terrene Trading Limited.

High quality product, one stop service, Provide Shinchu services to customers around the world!

Home > News > Content
Rigid FR4 PCB Copper Clad Sheet B Grade On Sale
- Dec 27, 2017 -

Basic Info

·         Model NO.: FR4 CCL B Grade

·         Solid Content: Fr4 CCL

·         Formation Methods: Copper Clad Laminate

·         Delivery: 7-10 Working Days

·         MOQ: 5 tons

·         Type: FR4Copper Clad Laminate Sheet

·         Material: Fiberglass+PP+Copper

·         Appliction: LED & Speaker

·         Customizable: Rigid PCB

·         Thermal Rating: H 180

·         Classification: Hybrid Insulation Materials

·         Color: Yellow

·         Origin: China

Product Description

Rigid PCB          FR4 Copper Clad Laminate  sheet  
           combines a woven glass fabric and an epoxy resin laminate (tg approximately 130°c) that contains bromine. The product provides consistent quality and good electrical properties under dry and humid conditions, as well as high flexural, impact, and bond strength at room temperatures. This product is suitable for a variety of structural, high humidity, and electrical insulation applications, which include terminal boards, lapping carriers.
 2.Specifications:
Thickness: 0.8mm,1.0mm,1.2mm,1.6mm
Thickness of copper:18um, 25um,35um. 
Copper: Single side (H/0) and double side (H/H)
Size: 1020mm*1220mm 
Features: 
1) The end face of foil covered board should be tidy without any delamination 
and crackle .
2) B grade will have small bubble, wrinkle, pin hole, deep nick, pitting and glue spot on the copper foil covered surface. Any color changing or dirty can be easily. removed by density 1.02g/cm3 hydrochloric acid or proper organic solution .
3. Applications:  Usually used in PCB of computers, home electric appliances and other lines.
 
FR4 CCL  /  Copper Clad Laminate    Technical Date:

FR4 TECHNICAL DATA SHEET 

NO

ITEM

UNIT

INDEX

1

Surface resistance after damp heat and recovery

1.3x105

2

Volume resistivity after damp heat and recovery

MΩ.m

1.63x106

3

Permittivity after damp heat and recovery

/

Max: 5.5

4

Dissipation factor after damp heat and recovery

/

0.017

5

Pulling strength

N

Min: 60

6

Peel strength after exposure to solvent vapour

N/mm

Min: 1.4

7

Blistering after 10s heat shock

/

No blistering or delamination

8

Solderability (wetting test)

S

2

9

Flexural strength

MPa

Min: 300

10

Flammability(vertical burning test) 

/

FV0 or FV1

11

Water absorption

mg

Max:5.9

12

Measling

/

No measling or blistering or delamination

13

Warpage

Bow

mm

Max: 18

Twist

Max: 20

 


Previous: Fr-4 Copper Clad Laminate Sheet/Ccl

Next: No Information